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COPPER
SPUTTERING TARGETS (Cu)

MATERIAL
OVERVIEW
Characteristics:
Distinctive reddish color; ductile; excellent
conductor of electricity.
Complexing agent, coordination numbers 2 and 4.
Dissolves readily in nitric and hot concentrated H2SO4,
in HCl and dilute H2SO4
slowly
but only when exposed to the atmosphere. More
resistant to atmospheric corrosion than iron, forming
a green layer of hydrated basic carbonate.
Readily attacked by alkalies. A necessary trace
element in human diet; a factor in plant metabolism.
Essentially nontoxic in elemental form. Powder is
combustible.
Derivation:
With sulfide ores the steps may be (1) concentration
(of low grade ores) by flotation and leaching, (2)
roasting, (3) formation of copper “matte” (40-50%
Cu), (4) reduction of matte to “blister” copper
(96-98%), (5) electrolytic refining to 99.9+% copper.
Hazard:
Toxic and flammable in finely divided form. Tolerance
(fume) 0.2 mg/m3;
(dusts and
mists)
1 mg/m3.
GENERAL
PROPERTIES
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Symbol:
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Cu
|
|
Atomic
Number:
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29
|
|
Atomic
Weight:
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63.546
|
|
Density:
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8.96
gm/cc
|
|
Melting
Point:
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1083.4
oC
|
|
Boiling
Point:
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2567
oC
|
|
Thermal
Conductivity:
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4.01
W/cm/oK
@ 298.2 oK
|
|
Electrical
Resistivity:
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1.678
microhm-cm @ 20 oC
|
|
Electronegativity:
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1.9
Paulings
|
|
Specific
Heat:
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0.092
Cal/g/oK
@ 25 oC
|
|
Heat
of Vaporization:
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72.8
K-cal/gm atom at 2567 oC
|
|
Heat
of Fusion:
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3.11
Cal/gm mole
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TYPICAL
ANALYSES
Impurities
in ppm
|
Material
/ Purity:
|
4N
|
5N
|
6N
|
|
Ag
|
1
|
0.3
|
0.2
|
|
As
|
10
|
1
|
-
|
|
Bi
|
2
|
0.2
|
-
|
|
Ca
|
-
|
0.1
|
0.3
|
|
Fe
|
2
|
0.1
|
0.1
|
|
Mg
|
1
|
0.2
|
0.1
|
|
Ni
|
30
|
-
|
-
|
|
Pb
|
3
|
0.1
|
-
|
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Sb
|
20
|
1
|
-
|
|
Si
|
5
|
0.2
|
0.2
|
|
Sn
|
5
|
0.2
|
-
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COPPER
SPUTTERING TARGETS
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Material
|
Purity
|
|
Copper
Sputtering Target 2"D X .125"T
|
3N,
4N, 5N
|
|
Copper
Sputtering Target 2"D X .250"T
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3N,
4N, 5N
|
|
Copper
Sputtering Target 3"D X .125"T
|
3N,
4N, 5N
|
|
Copper
Sputtering Target 3"D X .250"T
|
3N,
4N, 5N
|
|
Copper
Sputtering Target 4"D X .125"T
|
3N,
4N, 5N
|
|
Copper
Sputtering Target 4"D X .250"T
|
3N,
4N, 5N
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Additional
sizes and sputtering targets produced from compounds
are available
upon request.
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